When using modern assembly methods, like flip chip, CSP or Micro BGA, the electrical connection between the component and the substrate or PCB is created by a tiny ball of solder material.

To ensure a secure connection all bumps has to be in the right place, and they have to have the same height. Applying classical 2D inspection will only detect bumps in the wrong place or with the wrong diameter. Using SICK IVP Ranger technology also the bump height can be measured.

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