Connector inspection - Inspection of the position and height of the pins in a connector is very complicated with traditional 2D methods because there are no way of arranging the cameras to get a clear view of all pins. more...
3D Coplanarity inspection -
When using modern assembly methods, like flip chip, CSP or Micro BGA, the electrical connection between the component and the substrate or PCB is created by a tiny ball of solder material. more...
Solder paste inspection -
In today's electronic assembly lines solder paste misprints are causing the majority of the faults found in finalized circuit boards. more...
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